AMD has used Computex 2010 to introduce its Fusion advanced processing unit (APU) which combines CPU and GPU capabilities on a single die processor.
The Fusion APU combines an x86 CPU, DirectX 11 graphics processing unit, video processor and other co-processors on a single silicon die. Rick Bergman, senior vice president and general manager of AMD’s Products Group, introduced Fusion by holding aloft a 300mm silicon wafer containing hundreds of the APUs each of which contains more than 1 billion transistors at 32nm.
Elano will target the ultra portable market and compete with Intel’s CULV/i3 products while the Ontario range will square up with Intel’s mainstream product family.
AMD says that Fusion chips are on time and we should expect to see them shipping in hardware in the first half of 2011. The announcement at Computex is meant to gain support for the Fusion platform and get software developers supporting it in time for launch.
Check out AMD’s world first Fusion APU Demonstration at Computex video,
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